
Microcontrollers MCUs
Microchip PIC24FJ64GA004-E/PT PIC series Microcontroller IC 16-Bit 32MHz 64KB (22K x 24) FLASH 44-TQFP (1x1)
Browse Semiconductor-ICs electronic components from listed manufacturers.

Microcontrollers MCUs
Microchip PIC24FJ64GA004-E/PT PIC series Microcontroller IC 16-Bit 32MHz 64KB (22K x 24) FLASH 44-TQFP (1x1)

Battery Management
Fully Integrated 1A Linear Charger: The TP4056 eliminates external MOSFETs, diodes, and sense resistors, reducing design complexity and PCB space while maintaining efficient lithium-ion charge management. Intelligent Charging with Safety Protections: Its CC/CV algorithm, thermal regulation, trickle charge, and automatic recharge ensure long battery life, safety, and reliable performance across various portable devices. USB-Friendly Design: With its input voltage range and low component count, the TP4056 is ideal for USB-powered products, supporting global consumer electronics and IoT markets.

Voltage Regulators
Stable 5V / 1.5A output Excellent protection (thermal, short circuit) High PSRR and low noise performance

Microcontrollers MCUs
High-Speed Performance: Arm Cortex-M33 up to 250 MHz with DSP and FPU for precise real-time control. Advanced Security: Hardware HASH engine, TRNG, and tamper protection ensure data integrity. Industrial-Grade Reliability: ECC memories, wide temperature range, and robust LQFP48 package.

Semiconductor-ICs, Microcontrollers MCUs
Dual-core performance with ample SRAM – Two M0+ cores up to 133 MHz and 264 kB multi-bank SRAM keep control loops, UI, and I/O running smoothly in parallel. Programmable I/O (PIO) – Two PIO blocks (eight state machines) provide cycle-accurate pin control to emulate or extend peripherals like UART, video, or bespoke serial protocols—without extra ICs. Rich connectivity including USB 1.1 – Integrated full-speed USB with device/host modes, two each of UART/SPI/I²C, 16 PWM channels, 12-bit ADC, and 30 GPIO unlock a wide array of products with minimal components.

SoCs
Low power without compromises – Deep-sleep around 7 µA with LP memory retention, fast wakeup, and flexible PMU states. ETM and GDMA enable peripheral-driven data paths so your CPU can nap. Security you can ship – Secure Boot, flash encryption, and a full hardware crypto suite (AES/SHA/RSA/ECC/ECDSA/HMAC), plus a power-glitch detector and true RNG, help protect firmware/IP and elevate trust. Radio versatility – Bluetooth LE 5.3 with 2 M and Coded PHY for either speed or range, plus 802.15.4 for Thread/Zigbee/Matter—covering the majority of modern IoT transports with one tiny chip.

SoCs
Tri-radio on one chip: Dual-band Wi-Fi 6 + BLE 5 + IEEE 802.15.4 for Thread/Zigbee in a single, compact MCU. Security built-in: Secure boot, XTS-AES memory encryption, HMAC, RSA/ECC/ECDSA, TRNG, APM & PMP hardening—ready for zero-trust IoT. Designed for battery life: LP RISC-V core, deep-sleep with LP SRAM retention, Wi-Fi TWT, and fine-grained PMU control.

SoCs
USB device/host ready: Full-speed USB OTG with on-chip PHY streamlines accessories and field update paths. ULP always-on sensing: A dedicated ULP coprocessor handles RTC GPIO/ADC/touch while the main CPU sleeps. Hardened security chain: Secure boot + flash encryption + hardware AES/SHA/RSA and true RNG.

SoCs
Dual-core HP RISC-V up to 360 MHz + LP RISC-V up to 40 MHz for always-on tasks. Rich vision & video engine: JPEG codec, ISP (1080p), PPA (scale/rotate/blend), H.264 encoder (1080p@30 fps). Comprehensive security: Secure Boot, XTS-AES flash/PSRAM encryption, TRNG, RSA/ECDSA/HMAC/SHA accelerators, and access-permission management.

SoCs
Tri-radio in one chip: Wi-Fi 6 + Bluetooth LE 5.3 + 802.15.4 (Zigbee/Thread) with built-in coexistence on a single antenna. Secure by design: Secure boot, XTS-AES flash encryption, digital signature, RSA/ECC, and HMAC in hardware. Ultra-low power: Deep-sleep around 7 µA with LP-SRAM retention and Target Wake Time to extend battery life.

SoCs
USB all the things: Native USB 2.0 Full-Speed OTG plus a built-in USB-Serial/JTAG device for programming, logging, and on-chip debug with minimal parts. Vision & UI ready: Parallel LCD (8–16-bit RGB/I8080/6800) and DVP camera interfaces up to 40 MHz , with YUV/RGB conversions for low-cost displays and sensors. Hardened by design: Secure Boot , Flash Encryption , AES-128/256 , SHA-2 , RSA up to 4096-bit , HMAC , Digital Signature , and TRNG for modern, production-grade security.

SoCs
DSBGA-8 footprint for the smallest prototypes and z-height budgets. Full MSPM0C1104 feature set (24-MHz M0+, 12-bit ADC, UART/I²C/SPI) in a minuscule package. Explicit X-device status to de-risk production—prototype now, change package later.

SoCs
Quad-core Cortex-A55 up to 2.0 GHz for responsive, power-efficient embedded compute. 1 TOPS NPU + Mali-G52 GPU for edge AI and modern graphics/compute APIs. 4Kp60 decode, 1080p60 encode, and multi-display support for rich media scenarios.

SoCs
Quad-core Cortex-A55 up to 2.0 GHz for responsive, power-efficient embedded compute. 1 TOPS NPU + Mali-G52 GPU for edge AI and modern graphics/compute APIs. 4Kp60 decode, 1080p60 encode, and multi-display support for rich media scenarios.

SoCs
8-core 8 nm CPU with 6 TOPS NPU: Flagship compute and AI acceleration for demanding edge workloads. 8K-class multimedia engine: Decode 8K60, encode 8K30, and drive multi-display setups up to 8K@60. Rich, modern I/O: PCIe 3.0, USB 3.1, SATA 3.0, GbE, and flexible camera/display interfaces.

SoCs
6 TOPS on-chip NPU for private, low-latency AI at the edge. 8K60 decode + 8K30 encode for premium playback, recording, and signage. Dual 48MP ISP with HDR/3DNR for multi-camera vision systems.

Microcontrollers MCUs
DSBGA-8 footprint for the smallest prototypes and z-height budgets. Full MSPM0C1104 feature set (24-MHz M0+, 12-bit ADC, UART/I²C/SPI) in a minuscule package. Explicit X-device status to de-risk production—prototype now, change package later.

Microcontrollers MCUs
TSSOP-20 with ~17 GPIO for practical wiring and debugging. Nine 12-bit ADC channels (to 1.5 Msps) for multi-sensor builds. Same low-power DNA and software feel as MSPM0C110x for easy migration.

Microcontrollers MCUs
Leadless WQFN + exposed pad for solid grounding and heat spreading. Family low-power + fast wake to balance responsiveness and battery life. 12-bit ADC to 1.5 Msps for rapid, repeatable sampling in small form factors.

Microcontrollers MCUs
Middle-ground pin count in a slim SOT body—enough I/O for “real” designs without jumping to QFN. Family 24-MHz precision oscillator (crystal-less in many cases) for simpler BOM and height. Flexible internal VREF (1.4 V / 2.5 V) to match sensor ranges and improve ADC repeatability.