Evaluation Boards

Browse Evaluation Boards electronic components from listed manufacturers.

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Raspberry Pi 5 Case  Enclosure
Raspberry Pi 5 Case Enclosure

Evaluation Boards

PWM-managed thermals – Temperature-controlled fan plus adhesive heatsink sustain performance under continuous load. Tool-free access – Snap-fit assembly, removable lid, and a tidy breakout slot for cables and GPIO make rapid iteration easy. Expansion ready – Stackable mounting and HAT-on-case support (with standoffs and header extender) streamline clusters and add-on boards.

Texas Instruments TMDSLCDK6748 DSP Development Kit
Texas Instruments TMDSLCDK6748 DSP Development Kit

Evaluation Boards

Low cost, high utility – A dense mix of audio, video, Ethernet, USB, UART, and storage on one compact board dramatically reduces accessory sprawl during prototyping. Software-ready out of the box – Processor SDK RTOS and CCS examples shorten bring-up; you get working I/O and reference projects on day one. Open hardware collateral – Public schematics, PCB, and BOM accelerate custom board spin-ups and de-risk power, clocking, and layout choices.

TI MSP-EXP430FR2355 Microcontroller Development Kit
TI MSP-EXP430FR2355 Microcontroller Development Kit

Evaluation Boards

FRAM Memory: 32KB nonvolatile storage with 10^15 write cycles and 100ns write speed. Ultra-Low-Power Modes: Measure down to µA with 32.768kHz crystal for LPM sleep states. BoosterPack™ Ready: 40-pin headers support 100+ plug-in modules (wireless, displays, etc.). Integrated Debugging: eZ-FET probe enables programming + EnergyTrace power profiling. Sensor Hub: Includes ambient light sensor + Grove connector (P1.1/P1.4) for Seeed Studio modules.

Raspberry Pi 5 Embedded MCU, DSP Evaluation Boards
Raspberry Pi 5 Embedded MCU, DSP Evaluation Boards

Development Boards & Kits, Evaluation Boards

Breakthrough Compute & Graphics — 2.4 GHz quad-core Cortex-A76 with VideoCore VII (OpenGL ES 3.1 / Vulkan 1.2) drives dual 4Kp60 displays and smooth desktop/multimedia performance with ~2–3× CPU uplift vs. Pi 4. Next-Gen I/O with RP1 — Doubled per-port USB 3.0 (5 Gbps), dual 4-lane MIPI for dual cameras/displays, faster microSD SDR104, plus PCIe 2.0 x1 (via M.2 HAT) for NVMe SSD expansion. Deployment-Ready Design — On-board power button + PMIC, RTC header, USB-C PD (27 W recommended), Gigabit Ethernet with PoE+ HAT option, and a rich ecosystem (premium case with fan, Active Cooler, M.2/PoE+ HATs).